Aluminum nitride ceramic substrate

Product Features:

1. High thermal conductivity, more than 5 times that of alumina ceramics

2. Lower thermal expansion coefficient and close to silicon chip

3. Lower dielectric constant

4. Excellent insulation

5. Excellent mechanical properties, flexural strength higher than al2o3 and beo ceramics, can be sintered at atmospheric pressure

6. Heat-resistant, melt-resistant metal erosion

7. non-toxic

 

 Apply to :

such as communication devices, led packages, power electronics devices, semiconductor refrigeration devices, high-power integrated circuits, new energy vehicles, etc.

 

 

 

 

 

 

 

 

 

 

serial number

Item

Unit

Result

1

color


Gray

2

Volume density

(g/cm3)

       3.3

3

Roughness

um

0.01~0.7

4

Camber

Length‰

2

5

Flexural strength

Mpa

80

6

Moh's hardness


8

7

Thermal Conductivity

25℃,W/(m.k)

180/200

8

thermal expansivity

10-6/℃,100

4

9

dielectric coefficient

1MHz

8.8

10

dielectric loss

1MHz,10-4

3

11

volume resistivity

25℃,Ω.cm

1014

12

dielectric [electrical] strength

KV/mm

17


  • 电话直呼